
Lecture Description
This video lecture, part of the series Microfabrication Technology by Prof. Clark Nguyen, does not currently have a detailed description and video lecture title. If you have watched this lecture and know what it is about, particularly what Electrical Engineering topics are discussed, please help us by commenting on this video with your suggested description and title. Many thanks from,
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Course Index
- Process Integration
- Layout to Cross-Section, Design Rules
- Lithography I: Radiation Sources, Mask
- Lithography II: Optics, Resolutions
- Oxidation I: Thermal Oxidation
- Oxidation II: Theory and Graphs, Dopant Redistribution
- Physical Film Deposition: Evaporation
- Chemical Film Deposition: LPCVD
- Etching I: Anisotropy
- Ion Implantation I: Etching II - Plasma & Reactive Ion (RIE)
- Ion Implantation I: Range & Dry Etching
- Ion Implantation II: I/I Through
- Diffusion I: Predeposition & Drive-in Modeling
- Diffusion II: 2-Step Diffusion
- Diffusion III: Series Resistance
- Diffusion IV: Interconnects, Contacts
- Metal MEMS, Adv. CMOS I
- Adv. CMOS II: Process Flow
- Adv. Isolation: Problems w/ LOCOS
- Device Characterization I: MOS-CV
- Vt Implant: Threshold Voltage
- Device Characterization II: MOS Device
Course Description
In this course, Prof. Clark Tu-cuong Nguyen covers topics ranging from: Integrated circuit device fabrication and surface micromachining technology. Thermal oxidation, ion implantation, impurity diffusion, film deposition, expitaxy, lithography, etching, contacts and interconnections, and process integration issues. Device design and mask layout, relation between physical structure and electrical/mechanical performance. MOS transistors and poly-Si surface microstructures will be fabricated in the laboratory and evaluated.
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